HEAT DISSIPATING APPARATUS
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United States of America Patent
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Issued Date -
Dec 1, 2016
app pub date -
Jun 25, 2015
filing date -
May 29, 2015
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Abstract
A heat dissipating apparatus includes a case used to secure an electronic component and a heat dissipation module secured to the case to dissipate heat generated by the electronic component. The heat dissipation module includes a controller used to set a standard temperature value and a sensor used to be secured to the electronic component. The sensor senses a current temperature value to send to the controller, for allowing the controller to compare the current temperature value with the standard temperature value. When the current temperature value is higher than the standard temperature value, the heating dissipating module is powered on by the controller to dissipate heat generated by the electronic component.
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