Preform member bonding method

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United States of America Patent

PATENT NO 10717243
APP PUB NO 20160346973A1
SERIAL NO

15138271

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Abstract

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Provided is a preform member bonding method of bonding a preform member and another member with an adhesive in an RTM process. The preform member bonding method includes increasing viscosity of the adhesive by heat-treating only the adhesive in advance before inserting the adhesive between bonding surfaces of the preform member and the other member.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI HEAVY INDUSTRIES LTDJAPAN

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Akiyama, Hiromichi Tokyo, JP 25 10
Okuda, Akihisa Tokyo, JP 21 17
Yui, Yuichi Tokyo, JP 10 2

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