Liquid coating device

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 10137538
APP PUB NO 20160346878A1
SERIAL NO

15164944

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In the flux applying device, a control portion controls conveying rollers or the like so that thickness of flux applied to solder is controlled. The winding roller rotates so that the solder is conveyed at the conveying speed. The drawing-out roller applies any load (back tension) to the solder backward along the conveying direction of the solder when drawing out the solder. The solder is conveyed at the predetermined speed and dipped into the flux tank containing flux. The solder is pulled up from the flux tank at the conveying speed vertically. By pulling up the solder from the flux tank at the constant conveying speed vertically, the interfacial tension acts on the solder 9a and the flux, so that the flux having a uniform thickness according to the conveying speed remains on the surface and back surface of the solder.

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Patent Owner(s)

Patent OwnerAddress
SENJU METAL INDUSTRY CO LTD23 SENJU-HASHIDO-CHO ADACHI-KU TOKYO 120-8555

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hagiwara, Takashi Tochigi, JP 62 2330
Kameda, Naoto Tochigi, JP 15 12
Kikuchi, Kota Tokyo, JP 5 10
Muraoka, Manabu Tochigi, JP 11 71
Obayashi, Takashi Tochigi, JP 8 111
Saitoh, Takeo Tochigi, JP 6 11
Sekine, Shigeyuki Tochigi, JP 3 7
Tsuruta, Kaichi Tochigi, JP 25 199
Yamasaki, Hiroyuki Tochigi, JP 74 793

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