METHOD FOR CONNECTION OF PARTS COMPOSED OF MATERIALS THAT ARE DIFFICULT TO SOLDER
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United States of America Patent
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May 20, 2016
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May 21, 2015
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Abstract
A method for connecting a first part, composed of a difficult to solder material, with a second part. A wetting of a first surface of the first part, to be connected with the second part, with a first solder, and connecting the first solder with the first surface of the first part, takes place by introducing heat and ultrasound energy. A wetting of a second surface of the second part, to be connected with the first part, with a second solder takes place. Subsequently, machining of the surface of the first solder is carried out for removal of an oxide layer. Then the first and the second solder covered surfaces are brought into contact with one another, to form a unit. This is followed by exposing the unit to a temperature within a predetermined temperature range, which has an upper temperature limit of less than 800° C.
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