CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Nov 17, 2016
app pub date -
Mar 28, 2016
filing date -
May 12, 2015
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Abstract
A circuit board includes a top surface; a bottom surface; and a heat-dissipating portion, wherein the heat-dissipating portion extends from the top surface of the circuit board to the bottom surface of the circuit board, and a first surface of the heat-dissipating portion is exposed out of the top surface of the circuit board, and a second surface of the heat-dissipating portion is exposed out of the bottom surface of the circuit board.
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