FOCAL PLANE ARRAYS WITH BACKSIDE CONTACTS
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United States of America Patent
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Issued Date -
Nov 17, 2016
app pub date -
May 11, 2015
filing date -
May 11, 2015
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Abstract
A package assembly includes a package body and a focal plane array (FPA) within the package body. The FPA includes a read out integrated circuit (ROIC) having a circuit side. A photodiode array (PDA) defines an optical axis and has a backside electrically connected to the circuit side of the ROIC. A plurality of conductive through-vias extend from the circuit side of the ROIC through to input/output (I/O) bondpads on the backside of the ROIC. A window is operatively connected between the FPA and the package body.
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