SEMICONDUCTOR-WAFER CLEANING TANK AND METHOD OF MANUFACTURING BONDED WAFER
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United States of America Patent
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Issued Date -
Nov 17, 2016
app pub date -
Jan 13, 2015
filing date -
Jan 27, 2014
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Abstract
The present invention is a semi conductor-wafer cleaning tank in which semiconductor wafers are immersed in a cleaning solution and cleaned, including a tank body, composed of quartz, for storing the cleaning solution to immerse the semiconductor wafers in the cleaning solution, an overflow-receiving part, composed of quarts and provided around an opening of the tank body, for receiving the cleaning solution overflowing from an upper end of the opening of the tank body, and a heat-insulating wall-provided around the tank body, in which the heat-insulating wall forms an unbroken enclosure around the tank body with a hollow layer formed between the heat-insulating wall and a side wall of the tank body. As a result, there is provided a cleaning tank for use in an etching step that allows bonded wafers keeping film-thickness uniformity even after the etching step for adjusting the film thickness to be manufactured in high yield.
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