HEAT SINK AND METHOD FOR MANUFACTURING THE SAME

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United States of America Patent

APP PUB NO 20160334167A1
SERIAL NO

14809469

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure provides a heat sink configured for dissipating heat from an electronic component. The heat sink includes a heat pipe and a metal board. The metal board includes a first face and a second face. An opening is defined in the metal board. The opening penetrates the first face and the second face. The heat pipe is received in the opening, and the opening is an interference fit to the heat pipe. The present disclosure also provides a method for manufacturing the heat sink described above.

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Patent Owner(s)

Patent OwnerAddress
FOXCONN TECHNOLOGY CO LTD3-2 CHUNG SHAN ROAD TU-CHENG TAIPEI HSIEN

International Classification(s)

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  • 2015 Application Filing Year
  • B23P Class
  • 1059 Applications Filed
  • 692 Patents Issued To-Date
  • 65.35 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHEN, RUNG-AN New Taipei, TW 26 87
CHIU, HUNG-NIEN New Taipei, TW 7 25

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges199526326222101 - 1011 - 2021 - 3031 - 4051 - 6061 - 7081 - 900255075100125150175200225250275300325350375400425450475500525550575

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