THERMOPLASTIC MOULDING MATERIALS
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United States of America Patent
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Issued Date -
Nov 17, 2016
app pub date -
May 11, 2016
filing date -
May 12, 2015
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Abstract
Heat-stabilized polyamide-based compositions include a stabilizing system of at least one salt of citric acid and dipentaerythritol. The heat stabilized polyamide compositions are suitable for moulding materials, which in turn may be injection moulded, blow moulded, or extruded to produce articles of manufacture.
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