METHOD FOR BONDING USING ADHESIVE LAYERS WITH THE AID OF A LASER

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United States of America Patent

SERIAL NO

15223793

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Abstract

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The invention relates to a method and a device for bonding two substrates, wherein an adhesive is applied to a first substrate and a second film-type substrate consisting of a thermoplastic material is converted into a plasticized state by heating before being bonded to the first substrate.

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Patent Owner(s)

Patent OwnerAddress
TRUMPF LASER- UND SYSTEMTECHNIK GMBHJOHANN-MAUS-STR 2 DITZINGEN 71254

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Berger, Michael Ditzingen-Hirschlanden, DE 128 1266
Blodau, Marcel Krefeld, DE 9 10
Kinzelmann, Hans-Georg Pulheim, DE 41 130
Sauter, Martin Korntal-Muenchingen, DE 16 321

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