SUPER ABSORBENT RESIN CUTTING DEVICE AND SUPER ABSORBENT RESIN MANUFACTURING METHOD USING SAME

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United States of America Patent

SERIAL NO

15110799

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Abstract

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The present invention relates to a super absorbent resin cutting device and a super absorbent resin manufacturing method using the same. The super absorbent resin cutting device according to the present invention includes: an introduction unit for introducing a super absorbent resin; a cutter for cutting the super absorbent resin into pieces; and a discharge unit for discharging the super absorbent resin that has been cut.

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Patent Owner(s)

Patent OwnerAddress
HANWHA CHEMICAL CORPORATION86 CHEONGGYECHEON-RO JUNG-GU SEOUL 04541

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Choi, Dae Keon Jeollabuk-du, KR 7 12
Kim, Eui Duk Daejeon, KR 10 29
Kim, Ji Yeon Daegu, KR 146 611
Lee, Min Ho Daejeon, KR 84 425
Oh, Seok Heon Daejeon, KR 12 31
Paik, Choong Hoon Daejeon, KR 6 12
Sim, Yu Jin Daejeon, KR 7 12

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