WIRING BOARD
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United States of America Patent
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app pub date -
Jan 23, 2015
filing date -
Jan 24, 2014
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Abandoned
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Abstract
A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 μm or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 μΩ·cm or less.
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