ELECTRONIC DEVICES WITH YIELDING SUBSTRATES

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160327220A1
SERIAL NO

15215053

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

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Patent Owner(s)

Patent OwnerAddress
COOLEDGE LIGHTING INCSUITE 120-13551 COMMERCE PARKWAY RICHMOND BRITISH COLUMBIA V6V 2L1

International Classification(s)

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  • 2016 Application Filing Year
  • F21V Class
  • 4134 Applications Filed
  • 3005 Patents Issued To-Date
  • 72.69 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ASHDOWN, Ian West Vancouver, CA 91 4055
JUNGWIRTH, Paul Burnaby, CA 62 2345
SCHICK, Philippe M Vancouver, CA 46 602
SHEEN, Calvin Wade Derry, US 34 610
TISCHLER, Michael A Vancouver, CA 178 5255

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Patent Citation Ranking

  • 9 Citation Count
  • F21V Class
  • 12.62 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1306431534822147242501 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 90100 +050100150200250300350400450500550600650700

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