ELECTRONIC DEVICES WITH YIELDING SUBSTRATES
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United States of America Patent
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Issued Date -
Nov 10, 2016
app pub date -
Jul 20, 2016
filing date -
Jun 29, 2010
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Abstract
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.
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