Cured thermoset for high thermal conductive materials
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United States of America Patent
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-
Mar 6, 2018
Grant Date -
Nov 10, 2016
app pub date -
Dec 30, 2013
filing date -
Dec 30, 2013
priority date (Note) -
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Abstract
An article having a heat source and an electrically insulating thermal management component located in proximity to the heart source. The thermal management component contains a cured thermoset formed from a composition containing (a) a diglycidyl compound which has mesogenic structure and melting point of the diglycidyl compound is 150° C. or less, (b) a hardener and (c) an inorganic filler having specific thermal conductivity. The cured thermoset has high thermal conductivity.
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