METHOD FOR CUTTING WORKPIECE

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United States of America Patent

SERIAL NO

15109907

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Abstract

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A method for cutting a workpiece except silicon includes moving a resin-coated saw wire having a resin coating that covers the surface of a steel wire. In the method, at least one of the resin-coated saw wire or the workpiece is swung, a diamond abrasive grain having an average grain size of more than 0 μm and 8 μm or less is sprayed onto the resin-coated saw wire, and a wire running speed of the resin-coated saw wire is 800 m/min or higher.

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Patent Owner(s)

Patent OwnerAddress
KOBELCO RESEARCH INSTITUTE INC1-5-1 WAKINOHAMA-KAIGAN-DORI CHUO-KU KOBE-SHI HYOGO 6510073 ?6510073

International Classification(s)

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  • 2015 Application Filing Year
  • B28D Class
  • 139 Applications Filed
  • 101 Patents Issued To-Date
  • 72.67 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20152016201720182019202020212022202320240255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
ANAN, Masanori Hyogo, JP 2 0
MATSUSHIMA, Yoshitake Hyogo, JP 3 32
URATSUKA, Akinori Hyogo, JP 2 0
YOSHIKAWA, Kazuo Hyogo, JP 49 1000

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Patent Citation Ranking

  • 0 Citation Count
  • B28D Class
  • 0 % this patent is cited more than
  • 9 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges13435101 - 1011 - 2021 - 3002.557.51012.51517.52022.52527.53032.53537.54042.54547.5

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