Method of patterning electrically-conductive film on a flexible substrate
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United States of America Patent
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Nov 10, 2020
Grant Date -
Nov 10, 2016
app pub date -
Dec 30, 2014
filing date -
Dec 30, 2013
priority date (Note) -
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Abstract
A method of patterning a combined layer of an electrically-conductive film, such as indium-tin-oxide (ITO), that is disposed on a flexible substrate includes bending the combined layer about a radius of curvature. The combined layer is initially bent in a first direction so that the electrically-conducive film is distal to the radius of curvature, so as to form initial dielectric lines in the electrically-conductive film. The combined layer is then bent in another direction so that the electrically-conductive film is proximate to the radius of curvature to further enhance the dielectric performance of the initial dielectric lines. The dielectric lines electrically isolate a portion of the electrically-conductive film that is disposed therebetween, to form an electrically conductive electrode.
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International Classification(s)
- B26D:CUTTING; DETAILS COMMON TO MACHINES FOR SEVERING, ....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- B29C:SHAPING OR JOINING OF PLASTICS; SHAPING OF SUBSTAN....
- B26F:PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; ....
- H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
- B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
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