PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE PRINTED CIRCUIT BOARD
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United States of America Patent
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Issued Date -
Nov 3, 2016
app pub date -
Jun 30, 2015
filing date -
Apr 30, 2015
priority date (Note) -
Abandoned
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Abstract
A printed circuit board includes a plurality of layers and a via hole. The via hole extends through the plurality of layers. A coated film is coated on the inner wall of the via hole and located between two layers of the plurality of layers which need to be electrically connected.
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