DISSIPATING HEAT FROM ELECTRONIC DEVICES
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United States of America Patent
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Nov 3, 2016
app pub date -
Jul 12, 2016
filing date -
Jan 13, 2014
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Abstract
An electronic apparatus includes first and second electronic devices, and first and second heat sinks for dissipating heat, wherein there is each of electrical conductivity between the first electronic device and the first heat sink, thermal conductivity between the first electronic device and the first heat sink, electrical conductivity between the second electronic device and the second heat sink, and thermal conductivity between the second electronic device and the second heat sink, wherein electrical conductivity is provided between the first and second heat sinks, and wherein thermal resistance is provided between the first and second heat sinks, so that the second heat sink remains cooler than the first heat, such as for protecting the second electrical device from the heat generated by the first electronic device.
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