Device Including a Logic Semiconductor Chip Having a Contact Electrode for Clip Bonding
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United States of America Patent
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Issued Date -
Oct 27, 2016
app pub date -
Apr 21, 2016
filing date -
Apr 22, 2015
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Abstract
A device includes a logic semiconductor chip having a contact electrode. The contact electrode is configured to be electrically coupled to a contact clip based on a clip bonding technique.
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