REUSABLE THERMOPLASTIC THERMAL INTERFACE MATERIALS AND METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SOURCES AND HEAT DISSIPATING/REMOVAL STRUCTURES
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United States of America Patent
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Oct 27, 2016
app pub date -
Mar 30, 2016
filing date -
Apr 24, 2015
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Abstract
According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat sources and heat dissipating and/or heat removal structures, devices, or components. In exemplary embodiments, a thermal interface material is configured to have an inverse tan delta of at least 1.1 from about room temperature to about 125° C. and/or a bond line thickness predetermined to be at least 1.1 times greater than a largest filler particle size of the thermal interface material.
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