SUBSTRATE HEAT TREATMENT APPARATUS AND METHOD

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United States of America Patent

SERIAL NO

15203524

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Abstract

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Substrate heat treatment apparatus and method are provided. According to an embodiment of the present invention, there is provided a substrate heat treatment apparatus including an inner shell configured to form a substrate housing space to house at least one substrate, an outer shell configured to cover the inner shell, and having at least one gas hole, and at least one heater configured to heat the substrate, wherein the at least one gas hole is configured to allow a first gas to be injected into a space between the inner shell and the outer shell.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG DISPLAY CO LTD1 SAMSUNG-RO GIHEUNG-GU YONGIN-SI GYEONGGI-DO 17113
TERASEMICON CORPORATION164-5 JANGJI-RI DONGTAN-MYEON HWASEONG-SI GYEONGGI-DO 445-812

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
An, Sung Guk Suwon-si, KR 23 45
Heo, Jun Suwon-si, KR 44 172
Kang, Ho Young Hwaseong-si, KR 7 99
Lee, Byung Il Seongnam-si, KR 27 107
Park, Kyoung Wan Seongnam-si, KR 25 136
Yun, Jong Hyun Gwangmyeong-si, KR 15 74

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