CHIP SCALE CURRENT SENSOR PACKAGE AND METHOD OF PRODUCING A CURRENT SENSOR PACKAGE
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Nov 27, 2014
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Dec 10, 2013
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Abstract
The chip scale current sensor package comprises an IC chip (1) including a sensor (5) for measuring a magnetic field, and an electrically conductive layer (2) applied to a main surface (10) of the IC chip. The sensor is arranged for a measurement of a magnetic field generated by an electric current (6) flowing in the electrically conductive layer, and the electrically conductive layer is insulated from contact pads (4) electrically connecting the IC.
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