PRESSURE SENSOR PACKAGE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20160313201A1
SERIAL NO

14990317

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pressure sensor package includes a substrate, a pressure sensor, and a semiconductor circuit. The semiconductor circuit is disposed on one surface of the substrate and having a reception space open to one surface of the substrate. A pressure sensor is connected to the substrate and disposed in the reception space.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG ELECTRO-MECHANICS CO LTDGYEONGGI DO SOUTH KOREA GYEONGGI-DO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JEONG, Dae Hun Suwon-si, KR 25 71
LEE, Tae Hun Suwon-si, KR 41 176
LIM, Chang Hyun Suwon-si, KR 95 614

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges903966119812101 - 1011 - 2021 - 3031 - 4051 - 6061 - 7091 - 1000255075100125150175200225250275300325350375400425

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