PRESSURE SENSOR PACKAGE
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United States of America Patent
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Issued Date -
Oct 27, 2016
app pub date -
Jan 7, 2016
filing date -
Apr 23, 2015
priority date (Note) -
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Abstract
A pressure sensor package includes a substrate, a pressure sensor, and a semiconductor circuit. The semiconductor circuit is disposed on one surface of the substrate and having a reception space open to one surface of the substrate. A pressure sensor is connected to the substrate and disposed in the reception space.
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