ACID COPPER ELECTROPLATING BATH AND METHOD FOR ELECTROPLATING LOW INTERNAL STRESS AND GOOD DUCTIILITY COPPER DEPOSITS
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United States of America Patent
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Oct 27, 2016
app pub date -
Apr 27, 2015
filing date -
Apr 27, 2015
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Acid copper electroplating baths provide improved low internal stress copper deposits with good ductility. The acid copper electroplating baths include one or more branched polyalkylenimines and one or more accelerators. The acid copper electroplating baths may be used to electroplate thin films on relatively thin substrates to provide thin film copper deposits having low internal stress and high ductility.
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