DIE-CASTING SYSTEM WITH ENHANCED ADHERENCE SHOT SLEEVE POUR LINER

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United States of America Patent

APP PUB NO 20160311015A1
SERIAL NO

14695437

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pour liner for a shot sleeve of a die-casting system including a bonding layer within a slot in a shot sleeve substrate and a refractory metal layer adjacent to the bonding layer. A method of manufacturing a shot sleeve including forming a slot in the slot sleeve, laser cladding a bonding layer within the slot, and laser cladding a refractory metal layer onto the bonding layer.

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Patent Owner(s)

Patent OwnerAddress
UNITED TECHNOLOGIES CORPORATION10 FARM SPRINGS ROAD FARMINGTON CT 06032

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BOCHIECHIO, MARIO P VERNON, US 81 223
CHEN, ZHENG CHUAN Singapore, SG 1 3
HUI, CHEE YAO Singapore, SG 2 3
KWANG, LIM YUAN Singapore, SG 3 3
LING, CHARLENE KWAN YEE Singapore, SG 1 3
PANDEY, AWADH B JUPITER, US 39 223
SHAH, DILIP M GLASTONBURY, US 95 1979

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