LIQUID COOLING HEAT DISSIPATION STRUCTURE AND METHOD OF MANUFACTURING THE SAME
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Apr 17, 2015
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Apr 17, 2015
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Abstract
A liquid cooling heat dissipation structure includes a single heat conduction module and an assembly liquid supply module. The single heat conduction module includes a heat-conducting substrate contacting a heat generation source, a plurality of heat-conducting fins fixedly disposed on the heat-conducting substrate, a heat-conducting fluid-splitting board fixedly disposed on the heat-conducting substrate, and a heat-conducting fluid-conducting board fixedly disposed on the heat-conducting fluid-splitting board. The assembly liquid supply module includes an external cover body detachably disposed on the heat-conducting substrate and a rotary component detachably disposed between the external cover body and the heat-conducting fluid-conducting board. Therefore, cooling liquid passes through at least one liquid inlet and flows into the external cover body to contact the single heat conduction module by driving the rotary component, so that heat transmitted from the heat generation source to the single heat conduction module is absorbed by the cooling liquid.
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