ELECTRONIC PACKAGING STRUCTURE AND METHOD FOR FABRICATING ELECTRONIC PACKAGE
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United States of America Patent
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Issued Date -
Oct 20, 2016
app pub date -
Dec 28, 2015
filing date -
Apr 14, 2015
priority date (Note) -
Abandoned
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Abstract
An electronic packaging structure is provided, including a circuit portion, an electronic element disposed on an upper side of the circuit portion and a glass carrier disposed on a lower side of the circuit portion. By replacing a conventional silicon wafer with the glass carrier, the present invention eliminates the need of an adhesive layer and allows quick removal of the glass carrier during a subsequent process, thus saving the fabrication time and increasing the product yield. The present invention further provides a method for fabricating an electronic package.
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