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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
ACADEMISCH ZIEKENHUIS LEIDEN	2333 ZA LEIDEN
BIOMARIN TECHNOLOGIES B V	2333 CH LEIDEN

International Classification(s)

• A61K:PREPARATIONS FOR MEDICAL, DENTAL, OR TOILET PURPOS....
• C12N:MICRO-ORGANISMS OR ENZYMES; COMPOSITIONS THEREOF

• 2016 Application Filing Year
• A61K Class
• 19101 Applications Filed
• 13019 Patents Issued To-Date
• 68.16 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
AARTSMA-RUS, Annemieke	Hoofddorp, NL	32	1577
# of filed Patents : 32 Total Citations : 1577
De, KIMPE Josephus Johannes	Utrecht, NL	35	1153
# of filed Patents : 35 Total Citations : 1153
PLATENBURG, Gerard Johannes	Voorschoten, NL	37	1254
# of filed Patents : 37 Total Citations : 1254
Van, DEUTEKOM Judith Christina Theodora	Dordrecht, NL	64	2331
# of filed Patents : 64 Total Citations : 2331
Van, OMMEN Garrit-Jan Boudewijn	Amsterdam, NL	43	1951
# of filed Patents : 43 Total Citations : 1951

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Patent Citation Ranking

• 51 Citation Count
• A61K Class

• 99.44 % this patent is cited more than
• 9 Age

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11.5 Year Payment	$7400.00	$3700.00	$1850.00	Apr 20, 2028

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Full Text

US Patent Application No: 2016/0260,981

ELECTRODEPOSITED COPPER FOIL, AND ELECTRICAL COMPONENT AND BATTERY COMPRISING SAME

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Abstract

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Disclosed is an electrodeposited copper foil, in which a center line roughness average Ra (μm), a maximum height Rmax (μm), and a ten-point height average Rz (μm) of a matte side satisfy an Equation below, 1.5≦(Rmax−Rz)/Ra≦6.5. The electrodeposited copper foil according to the present invention maintains low roughness and high strength, and exhibits a high elongation rate, and particularly, has excellent glossiness, so that the electrodeposited copper foil may be used in a current collector of a medium and large lithigum ion secondary battery and a semiconductor packaging substrate for Tape Automated Bonding (TAB) used in a Tape Carrier Package (TCP).

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Description

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Claims

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