Circuit board and method of manufacturing the same
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United States of America Patent
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Oct 10, 2017
Grant Date -
Oct 13, 2016
app pub date -
Jan 7, 2016
filing date -
Apr 8, 2015
priority date (Note) -
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Abstract
A circuit board includes an insulating material; and a heat-transfer structure comprising a plurality of heat-dissipating members and inserted in the insulating material, wherein the plurality of heat-dissipating members each includes a metal wire; and an insulating part disposed on an outer circumferential surface of the metal wire excluding a top surface and a bottom surface of the metal wire.
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