Insulated Gate Bipolar Transistor and Production Method Thereof

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United States of America Patent

APP PUB NO 20160300938A1
SERIAL NO

15103671

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Abstract

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One embodiment of the present invention includes preparing a first conductive semiconductor substrate manufactured using the MCZ method. A second conductive base layer (12), first conductive emitter regions (13), and gate electrodes (14) are formed on a first surface of the semiconductor substrate. The semiconductor substrate is thinned by machining the second surface of the semiconductor substrate and a second conductive collector layer (15) is formed by implanting boron into the thinned second surface. A first conductive buffer layer (16) having a higher impurities concentration than the semiconductor substrate is formed by implanting hydrogen into an area inside the semiconductor substrate and adjacent to the collector layer (15).

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Patent Owner(s)

Patent OwnerAddress
ULVAC INCKANAGAWA JAPAN KANAGAWA

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakagawa, Akio Kanagawa, JP 186 4159
Suzuki, Hideo Kanagawa, JP 375 5761
Tonari, Kazuhiko Kanagawa, JP 11 16
Yokoo, Hidekazu Kanagawa, JP 5 12

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