Lead-Free Solder Alloy and Semiconductor Device
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United States of America Patent
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Oct 13, 2016
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Nov 20, 2013
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Nov 20, 2013
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A semiconductor device 20 has: a semiconductor chip 1; a connected member 5 connected to the semiconductor chip 1 via a solder alloy (lead-free solder alloy) 2; and an external terminal electrically connected to the semiconductor chip 1. The above-described solder alloy 2 of the semiconductor device 20 is composed of: Cu of 5 to 10 weight %; any one, two, or more of Bi of 1 weight % or more and 4 weight % or less, Sb of 1 weight % or more and less than 10 weight %, and In of 1 weight % or more and 4 weight % or less; and Sn as a residual.
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