PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Oct 13, 2016
app pub date -
Mar 4, 2016
filing date -
Mar 4, 2016
priority date (Note) -
Abandoned
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Abstract
There is provided a printed circuit board includes a substrate having product areas for mounting elements and dummy areas disposed between two neighboring product areas, external connection terminals disposed on the product areas, and a plurality of dummy bumps disposed on the dummy areas.
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