COPPER ALLOY FOR ELECTRIC AND ELECTRONIC DEVICE, COPPER ALLOY SHEET FOR ELECTRIC AND ELECTRONIC DEVICE, CONDUCTIVE COMPONENT FOR ELECTRIC AND ELECTRONIC DEVICE, AND TERMINAL
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United States of America Patent
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Issued Date -
Oct 13, 2016
app pub date -
Aug 29, 2013
filing date -
Aug 29, 2013
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Abstract
A copper alloy for electric and electronic devices includes: Zn at 23 mass % or more and at 36.5 mass % or less; Sn at 0.1 mass % or more and 0.9 mass % or less; Ni at 0.15 mass % or more and less than 1.0 mass %; Fe at 0.001 mass % or more and less than 0.10 mass %; Co at 0.001 mass % or more and less than 0.1 mass %; P at 0.005 mass % or more and 0.1 mass % or less; and a balance including Cu and unavoidable impurities, wherein a ratio Fe/Ni satisfies 0.002≦Fe/Ni<0.7 by atomic ratio, a ratio (Ni+Fe)/P satisfies 3<(Ni+Fe)/P<15 by atomic ratio, a ratio Sn/(Ni+Fe) satisfies 0.3
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