DIE WITH A DIE STRUCTURE AS WELL AS METHOD FOR ITS PRODUCTION

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United States of America Patent

APP PUB NO 20160299424A1
SERIAL NO

15035568

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Abstract

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A method for the production of a structural die that has die structures for applying microstructures and/or nanostructures on substrates or soft dies, whereby the die structures are comprised at least partially of a die material with low adhesion properties.

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Patent Owner(s)

Patent OwnerAddress
EV GROUP E THALLNER GMBHDI ERICH THALLNER STRASSE 1 ST FLORIAN AM INN A-4782

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
CHOUIKI, Mustapha Linz, AT 5 9

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