BASE FILM FOR DICING SHEET AND METHOD OF MANUFACTURING BASE FILM

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United States of America Patent

APP PUB NO 20160297180A1
SERIAL NO

15037537

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A base film (2) includes an expandable layer (B) laminated on a cutting-fragment suppression layer (A) and having a laminate structure of a plurality of resin-based sublayers. The resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R1) after 5 minutes of 10%-stretching. The resin-based sublayer (B2) other than the resin-based sublayer (B1) disposed nearest to the cutting-fragment suppression layer (A) has a stress-relaxation rate (R2) after 5 minutes of 10%-stretching. The cutting-fragment suppression layer (A) contains a ring-containing resin (a1) that is a thermoplastic resin having at least one type of an aromatic series-based ring and an aliphatic series-based ring and an acyclic olefin-based resin (a2) that is an olefin-based thermoplastic resin other than the ring-containing resin (a1).

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Patent Owner(s)

Patent OwnerAddress
LINTEC CORPORATION23-23 HONCHO ITABASHI-KU TOKYO 1730001

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
MIYAZAKI, Kentaro Tokyo, JP 37 118
NAKAMURA, Junichi Tokyo, JP 296 5382
TAYA, Naoki Tokyo, JP 46 111

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