LIGHT-EMITTING DIODE (LED) PACKAGE
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United States of America Patent
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Issued Date -
Oct 6, 2016
app pub date -
Apr 1, 2016
filing date -
Apr 1, 2016
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Abstract
A light-emitting diode (LED) package including a rectangular carrier, an LED chip, and an encapsulant is provided. The rectangular carrier has an upper surface. The LED chip is mounted on the upper surface and is electrically connected to the rectangular carrier. The encapsulant has a curved convex surface and covers the entire upper surface and the LED chip. The encapsulant is doped with a phosphor material for converting at least parts of light emitted from the LED chip. The encapsulant doped with the phosphor material is visually neon orange when the LED chip does not emit the light.
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