SYSTEM IN PACKAGE AND METHOD FOR MANUFACTURING THE SAME
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United States of America Patent
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Issued Date -
Oct 6, 2016
app pub date -
Nov 24, 2015
filing date -
Apr 3, 2015
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Abstract
Disclosed herein is a system in package and a method of manufacturing the same. The system in package includes a first semiconductor die including a plurality of bond pads, a lead frame disposed around the first semiconductor die and provided with a plurality of signal leads, a second semiconductor die disposed in an upper side of the first semiconductor die and connected to the lead frame by wire bonding, and a fan out metal pattern disposed in a lower side of the first semiconductor die and the lead frame to connect the bond pads and the signal leads electrically and provided with a plurality of metal pads.
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