STRUCTURED INTEGRATED CIRCUIT DEVICE WITH MULTIPLE CONFIGURABLE VIA LAYERS
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 6, 2016
app pub date -
Apr 1, 2015
filing date -
Apr 1, 2015
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
An integrated circuit may include a multi-layer structure having alternating metal interconnection layers and via layers superimposed on a base layer having electronic components, functional blocks, or both. At least two of the via layers may be customizable and may be used to form customized interconnections that may customize functionality of the resulting integrated circuit. In a variant, at least some of the layers may have a default structure that may result in a default integrated circuit functionality; the default structure may be changed to customize functionality. One or more metal interconnection layers may also be customizable. Additionally, transistors of the base layer may be customized for speed and/or power consumption by adjusting voltage thresholds and/or gate lengths.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully