ELECTRONIC DEVICE WITH DUMMY IC DIE AND RELATED METHODS
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United States of America Patent
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Issued Date -
Oct 6, 2016
app pub date -
Mar 31, 2015
filing date -
Mar 31, 2015
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Abstract
An electronic device may include a substrate, an active IC die above the substrate, and a dummy IC die above the active IC die. The electronic device may include a first adhesive layer between the active IC die and the dummy IC die, and a heat sink layer above the dummy IC die and extending laterally outwardly to define a gap between the substrate and opposing portions of the heat sink layer.
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