DETERMINING CONTACT EDGE ROUGHNESS OF A CONTACT HOLE ETCHED IN A WAFER
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United States of America Patent
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N/A
Issued Date -
Oct 6, 2016
app pub date -
Mar 31, 2015
filing date -
Mar 31, 2015
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Embodiments of the present invention provide methods, systems, apparatuses, and computer program products for determining the contact edge roughness of a contact hole etched in a wafer. One embodiment provides a method comprising acquiring image data corresponding to the hole; based at least in part on the image data, determining a hole profile; determining an ideal shape for the hole based at least in part on the hole profile; and determining the contact edge roughness based at least in part on the hole profile and ideal shape. The hole profile may be configured to describe a distance from a reference point of the contact hole to an edge of the contact hole for each of a predetermined set of angles and the ideal shape may be described by a distance from a reference point of the ideal shape to an edge of the ideal shape for each predetermined angle.
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