PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, ELECTRONIC DEVICE, BLOCK COPOLYMER AND BLOCK COPOLYMER PRODUCTION METHOD

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United States of America Patent

SERIAL NO

15172639

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Abstract

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There are provided a pattern forming method in which, in self-organization lithography using a graphoepitaxy method, high miniaturization of patterns can be achieved with high quality and high efficiency by a pattern forming method including (i) a step of forming a block copolymer layer containing a specific first block copolymer or a specific second block copolymer on a specific substrate, (ii) a step of phase-separating the block copolymer layer, and (iii) a step of selectively removing at least one phase of a plurality of phases of the block copolymer layer, an electronic device manufacturing method using the pattern forming method and the electronic device, and a block copolymer used in the pattern forming method and the production method thereof.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATIONTOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KIMURA, Keizo Haibara-gun, JP 96 683
MITANI, Eriko Haibara-gun, JP 1 2
SAITOH, Shoichi Haibara-gun, JP 14 64
TAKIZAWA, Hiroo Haibara-gun, JP 119 1001
YOSHIDA, Hayato Haibara-gun, JP 28 364

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