PHOTONIC INTEGRATED CIRCUIT CHIP PACKAGING
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United States of America Patent
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app pub date -
Sep 28, 2015
filing date -
Apr 1, 2015
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Abstract
A localized hermetic sealing of a photonic integrated circuit component chip mounted in a photonic integrated circuit device chip to protect a chip-to-chip interface from contamination, thereby enhancing functionality and reliability. A covering lid mounted on or over the component chip is hermetically sealed to the device chip surrounding the component chip forming a localized hermetically sealed area.
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