METHOD FOR FORMING ANTI STICTION COATING AND ANTI STICTION COATING THEREOF

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United States of America Patent

SERIAL NO

15177129

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Abstract

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A method for forming an anti-stiction coating on a surface of a semiconductor device is provided. Using atomic layer deposition (ALD) processes to activate surface prior to anti-stiction coating deposition, anti-stiction coating having strong chemical bonding to the surface is obtained.

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Patent Owner(s)

Patent OwnerAddress
HIMAX DISPLAY INCNO 26 ZILIAN RD XINSHI DIST TAINAN CITY 74148

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gelder, Roland V Tainan City, TW 5 6

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