MEMS PACKAGING
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United States of America Patent
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Issued Date -
Oct 6, 2016
app pub date -
Mar 31, 2015
filing date -
Mar 31, 2015
priority date (Note) -
Published
status (Latency Note)
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Abstract
A packaged electronic component comprising at least one movable part, comprising lower and upper layers, each formed with a depression in an inwards-facing side of the component, the depressions forming a cavity within the component, a MEMs component rigidly joined at least one proximal location to the lower and upper layers, wherein the MEMs component extends from the at least one proximal location into the cavity such that a distal region of the MEMs component can move within the cavity.
First Claim
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