BONDING STATE DETECTION METHOD
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United States of America Patent
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Oct 6, 2016
app pub date -
Nov 19, 2015
filing date -
Nov 19, 2015
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Abstract
A bonding state detection method is provided for detecting a bonding state of two substrates. Firstly, a first adhesive element, a second adhesive element, a first substrate and a second substrate are provided. The first adhesive element includes a sensing layer with a first sensing unit and a second sensing unit. After the first substrate and the second substrate are bonded together through the first adhesive element and the second adhesive element, a first resistance value of the first sensing unit and a second resistance value of the second sensing unit are detected. Then, according to the result of comparing the first resistance value with the second resistance value, the bonding state of the first adhesive element and the second adhesive element is judged. Consequently, the bonding state of the first substrate and the second substrate is realized.
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