METHOD FOR GRINDING WAFERS BY SHAPING RESILIENT CHUCK COVERING
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United States of America Patent
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Issued Date -
Oct 6, 2016
app pub date -
Mar 30, 2015
filing date -
Mar 30, 2015
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Abandoned
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Abstract
A method for facilitating and improving the production of quality thin wafers by adhering traditional resilient back-grind tape that has been perforated over the area that will contact the wafer on the ceramic porous grind chuck, so as to allow a vacuum to be applied to the wafer back surface to hold the wafer for processing. The tape adhering to a first surface of the chuck is ground with an abrasive grind wheel, bringing the surface of the tape parallel to the chuck surface which was previously ground by the same grinding device. The wafer is then flipped over and placed on the chuck, the second surface of the wafer then being ground. Grinding the tape while it is mounted on the chuck establishes the plane perpendicular to the grind wheel spindle, removes the bumpiness from the perforation holes and evens out the non-uniformity of the tape, resulting in improved wafer back side grinding and thus good site flatness.
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