Laminate and circuit board

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United States of America Patent

PATENT NO 10849231
APP PUB NO 20160286653A1
SERIAL NO

14778162

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.

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Patent Owner(s)

Patent OwnerAddress
TOPPAN EDGE INC1-7-3 HIGASHI-SHIMBASHI MINATO-KU TOKYO 105-8311

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mori, Akihito Tokyo, JP 44 366

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