Wireless serial links for communications between devices formed in a package
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United States of America Patent
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May 12, 2020
Grant Date -
Sep 29, 2016
app pub date -
Apr 4, 2016
filing date -
Aug 17, 2009
priority date (Note) -
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Abstract
In various embodiments, a memory module houses memory devices and, in some embodiments, a memory controller. Each of the devices has a near-field interface coupled to loop antennas to communicate over-the-air data. A coil is formed on, for example, a memory device substrate or molded into a plastic mold to create near-field magnetic coupling between the stacked memory devices and, in certain embodiments, the memory controller. Other embodiments are disclosed.
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