Chip on submount module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 11431146
APP PUB NO 20160285233A1
SERIAL NO

14920490

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A chip on submodule includes a submount having a top surface, bottom surface and side surfaces. A positive electrode plate is affixed to a first portion of one side surface, the top surface and a first portion of the bottom surface. The positive electrode plated first portion of the one side surface and the top surface are interconnected. A connector electrically connects the positive electrode plated top surface to the first portion of the bottom surface. A negative electrode plate is affixed to a second portion of the one side surface and a second portion of the bottom surface. The negative electrode plated second portion of the one side surface and second portion of the bottom surface are interconnected. A laser diode is affixed to the positive electrode plated first portion of the one side surface and connected to the negative electrode plated second portion of the one side surface.

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First Claim

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Patent Owner(s)

Patent OwnerAddress
JABIL INC10560 DR MARTIN LUTHER KING JR STREET N ST PETERSBURG FL 33716

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Runge, Lars St. Petersburg, US 1 5
Victoria, Lorito E St. Petersburg, US 1 5

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