ELECTRICAL CONNECTOR AND SOCKET FOR ELECTRICAL COMPONENT
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United States of America Patent
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Issued Date -
Sep 29, 2016
app pub date -
Mar 13, 2014
filing date -
Mar 21, 2013
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Abstract
Contact pins are provided in a socket main body into which an IC package is accommodated and brought into electrical contact with connection terminals of the IC package. Each contact pin is formed of layers obtained by laminating an underlying layer containing Ni and a surface layer successively on a conductive base material. The surface layer includes a first layer on an underlying layer side, and a second layer in contact with the connection terminals. The first layer is formed of a plating layer of which a principal ingredient is a Pd—Ni alloy which is a material lower in diffusion speed of Sn than that of Pd, among materials into which Sn dissolves and diffuses by applying heat. The second layer is formed of a plating layer of which a principal ingredient is Ag which is a material lower in diffusion speed of Sn than that of the first layer.
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